CM1206 Datasheet, PDF (2/7 Pages) California Micro Devices Corp – ESD Protection Arrays, Chip Scale Package

CM1206
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
A
B
123
L06
Orientation
Marking
(see note 2)
A
B
TOP VIEW
(Bumps Down View)
12345
120608
Orientation
Marking
(see note 2)
A
TOP VIEW
(Bumps Down View)
12345
BOTTOM VIEW
(Bumps Up View)
CM1206-04
CSP Package
B1 B2 B3
A1 A2 A3
BOTTOM VIEW
(Bumps Up View)
CM1206-08
CSP Package
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
BOTTOM VIEW
(Bumps Up View)
D1 D2 D3 D4 D5
B _CM1206
C 16
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
D
A1 A2 A3 A4 A5
CM1206-16
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish²
Bumps
Package
Ordering Part
Number¹
Part Marking
Ordering Part
Number¹
Part Marking
6
CSP
CM1206-04CS
L06
CM1206-04CP
L06
10
CSP
CM1206-08CS
120608
CM1206-08CP
120608
20
CSP
CM1206-16CS
CM120616
CM1206-16CP
CM120616
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark
© 2004 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 06/28/04