CM1452 Datasheet, PDF (5/6 Pages) California Micro Devices Corp – LCD & Camera EMI Filter Array with ESD Protection

PRELIMINARY
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad size in PCB
0.240mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.300mm (round)
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
Tolerance – Edge to Corner Ball
50µm
Solder Ball Side Coplanarity
20µm
Soldering Minimum Temperature
205’C for at least 30 seconds
Maximum Dwell Time above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
260’C for at less than 2 minutes
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: [phone] Fax: [phone]
www.calmicro.com
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