CSPEMI607 Datasheet, PDF (4/5 Pages) California Micro Devices Corp – 4-Channel LCD EMI Filter Array with ESD Protection plus 4-Channel of ESD Protection Array

California Micro Devices
430 N.McCarthy Blvd
Milpitas, CA 95035
PRELIMINARY
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad size in PCB
0.275mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm (round)
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
Tolerance – Edge to Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Soldering Minimum Temperature
205’C for at least 30 seconds
Maximum Dwell Time above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
240’C for at less than 2 minutes
Solder Reflow Profile
11/18/03 Tel: [phone] • Fax: [phone] • Website: www.calmicro.com
4