PACDN1408C Datasheet, PDF (3/3 Pages) California Micro Devices Corp – ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE

CALIFORNIA MICRO DEVICES
PACDN1408C
PACDN2408C
Package Diagram
0.252mm
3.104mm
0.65mm
B
A
0.35mm dia.
Bumps
12345
0.381mm
0.643mm
Pin Orientation
Both parts are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part
may rotated 180° without affecting operation.
PRINTED CIRCUIT BOARD RECOMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
Solder Paste
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
Typical Solder Reflow Thermal Profile (No Clean Flux)
© 2000 California Micro Devices Corp. All rights reserved.
6/19/2000
215 Topaz Street, Milpitas, California 95035 Tel: [phone] Fax: [phone] www.calmicro.com
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