CSPPT Datasheet, PDF (3/4 Pages) California Micro Devices Corp – CHIP SCALE PARALLEL TERMINATION ARRAY

CALIFORNIA MICRO DEVICES
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
Solder Paste
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
CSPPT
Typical Solder Reflow Thermal Profile (No Clean Flux)
250
EXH PH
225
200
175
150
125
100
75
50
25
0
48
Z2
Z3
Z4
Z5
RF
97
145
194
242
290
Time (s)
CD
EXH
339
387
435
PART NUMBER KEY
CSP PT YY XXX T
PACKAGE TYPE
CSP = Chip Scale
Package
APPLICATION
Parallel Termination
Number of
Terminations
08 = 8
16 = 16
32 = 32
Resistor
Value Code
R1 Value
First 2 digits
are significant
value. 3rd digit
represents number
of zeros
Tolerance
F = ±1%
J = ±5%
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000 215 Topaz Street, Milpitas, California 95035
Tel: [phone]
Fax: [phone]
www.calmicro.com
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