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CM1405 Datasheet, PDF (10/11 Pages) California Micro Devices Corp – LCD EMI Filter Array with ESD Protection
CM1405
Mechanical Details
CM1405-01 Mechanical Specifications
The package dimensions for the CM1405-01 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 3.955 4.000 4.045 0.1557 0.1575 0.1593
A2 1.413 1.458 1.503 0.0556 0.0574 0.0592
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.200 0.250 0.300 0.0079 0.0098 0.0118
C2 0.244 0.294 0.344 0.0096 0.0116 0.0135
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
A
1234567 8
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
SIDE
VIEW
D1
D2
Package Dimensions for
CM1405-01 Chip Scale Package
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/16/04