CM1230 Datasheet, PDF (10/11 Pages) California Micro Devices Corp – 2, 4 and 8-Channel Low Capacitance ESD Protection Array

PRELIMINARY
CM1230
Mechanical Details (cont’d)
CSP-10 Mechanical Specifications
The CM1230-08CS/CP is supplied in a 10 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the Califor-
nia Micro Devices CSP Package Information docu-
ment.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 0.915 0.960 1.005 0.0360 0.0378 0.0396
A2 2.415 2.460 2.505 0.0951 0.0969 0.0986
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
5
4
3
2 BA
1
BA
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1230-08 Chip Scale Package
© 2006 California Micro Devices Corp. All rights reserved.
10
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 03/15/06