CM1230 Datasheet, PDF (1/11 Pages) California Micro Devices Corp – 2, 4 and 8-Channel Low Capacitance ESD Protection Array

PRELIMINARY
CM1230
2, 4 and 8-Channel Low Capacitance ESD Protection Array
Features
• 2, 4 and 8 channels of ESD protection
• Provides ESD protection to IEC61000-4-2 Level 4
• ±8kV contact discharge
• ±15kV air discharge
• Low loading capacitance of 0.8pF typical
• Minimal capacitance change with temperature and
voltage
• Channel I/O to GND capacitance difference of
0.02pF typical is ideal for differential signals
• Channel I/O to I/O capacitance 0.15pF typical
• Zener diode protects supply rail and eliminates the
need for external by-pass capacitors
• Each I/O pin can withstand over 1000 ESD strikes
• Available in 4, 6 and 10 bump Chip Scale Pack-
ages (CSP)
• OptiGuard™ coated for improved reliability at
assembly
• Lead-free version available
Applications
• LCD and Camera data lines in wireless handsets
that use high-speed serial interfaces.
• I/O port protection for mobile handsets, notebook
computers, DSCs, MP3 players, PDAs, etc. includ-
ing USB, 1394 and Serial ATA
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Product Description
The CM1230 is a family of 2, 4 and 8 channel, very low
capacitance ESD protection diode arrays in CSP form
factor. This device is ideal for protecting systems with
high data and clock rates or for circuits that require low
capacitive loading. Each channel consists of a pair of
ESD diodes that act as clamp diodes that steer positive
or negative ESD current pulses to either the positive or
negative supply rail. A zener diode is integrated into
the array between the positive and negative supply
rails. The V_CC rail is thus protected from ESD strikes
and eliminates the need for a bypass capacitor to
absorb positive ESD strikes to ground. Each channel
of the CM1230 can safely dissipate ESD strikes of
±8kV, meeting the Level 4 requirement of the
IEC61000-4-2 international standard for contact dis-
charges as well as ±15kV air discharges per the
IEC61000-4-2 specification. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact dis-
charges at greater than ±15kV.
This device is particularly well-suited for next genera-
tion wireless handsets that implement high-speed
serial interface solutions for the LCD display and cam-
era interfaces. In these wireless handset designs, a
tolerance above 1.5pF cannot be tolerated due to the
high data rates that are transferred between the base-
band chipset and the LCD driver/controller ICs
because a higher capacitive loading will cause the rise
and fall times to slow which in turn hampers the func-
tionality of circuit and operation of the wireless hand-
set.
The CM1230 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1230 is
available in a space-saving, low profile Chip Scale
Package with optional lead-free finishing.
Electrical Schematic
V_P
CH4
V_P
CH3
CH8
CH7
V_P
CH6 CH5
CH1
CH2
V_N
CM1230-02CS/CP
CH1
V_N
CH2
CM1230-04CS/CP
CH1 CH2
V_N
CH3
CH4
CM1230-08CS/CP
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com
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