DRV401 Datasheet, PDF (4/28 Pages) Burr-Brown (TI) – Sensor Signal Conditioning IC for Closed-Loop Magnetic Current Sensor

DRV401
SBVS070A − JUNE 2006 − REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, T_J = −40°C to +125°C, with zero output current I_COMP.
At T_A = +25°C and V_DD1 = V_DD2 = +5V with external 100kHz filter BW, unless otherwise noted.
DRV401
PARAMETER
CONDITIONS
MIN
TYP
VOLTAGE REFERENCE
Voltage⁽²⁾
Drift⁽²⁾
PSRR⁽²⁾
Load Regulation⁽²⁾
Short-Circuit Current
No Load
No Load
Load to GND/V_DD, dI = 0mA to 5mA
I_SC
REF_OUT Connected to V_DD
REF_OUT Connected to GND
2.495
2.5
±5
±15
0.15
+20
−18
DEMAGNETIZATION
Duration
See Timing Diagram
106
www.ti.com
MAX
2.505
±50
±200
130⁽³⁾
UNITS
V
ppm/°C
µV/V
mV/mA
mA
mA
ms
DIGITAL I/O
LOGIC INPUTS (DEMAG, GAIN, and CCdiag Pins)
Pull-Up High Current (CCdiag)
Pull-Up Low Current (CCdiag)
Logic Input Leakage Current
Logic Level, Input: L/H
Hysteresis
OUTPUTS (ERROR AND OVER-RANGE Pins)
Logic Level, Output: L
Logic Level, Output: H
OUTPUTS (PWM and PWM Pins)
Logic Level L
Logic Level H
CMOS Type Levels
3.5 < V_IN < V_DD
0 < V_IN < 1.5
0 < V_IN < V_DD
4mA Sink
Push-Pull Type
4mA Sink
4mA Source
160
µA
5
µA
0.01
5
µA
2.1/2.8
V
0.7
V
0.3
V
No Internal Pull-Up
0.2
V
(V_DD) − 0.4
V
POWER SUPPLY
Specified Voltage Range
Power-On Reset Threshold
Quiescent Current [I(V_DD1) + I(V_DD2)]
Brownout Voltage Level⁽²⁾
Brownout Indication Delay
VDD
4.5
V_RST
I_Q I_COMP = 0mA, Sensor Not Connected
5
5.5
V
1.8
V
6.8
mA
4
V
135
µs
TEMPERATURE RANGE
Specified Range
Operating Range
Package Thermal Resistance
QFN Surface-Mount
SO PowerPAD Surface-Mount
T_J
T_J
q_JA
See Note 6
q_JA
See Note 6
−40
+125
°C
−50
+150
°C
40
°C/W
27
°C/W
(1) _{Parameter value referred to output (RTO).}
(2) _{See Typical Characteristic curves.}
(3) _{Total input resistance and comparator threshold current are inversely related. See Figure 2a.}
(4) _{For VAC sensors, 0.2% of PWM offset approximately corresponds to 10mA primary current offset per winding.}
(5) _{See Compensation Driver section in Applications Information.}
(6) _{See Applications Information section for information on power dissipation, layout considerations, and proper PCB soldering and heat-sinking technique.}
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