BUF11702 Datasheet, PDF (22/24 Pages) Burr-Brown (TI) – MULTI CHANNEL LCD GAMMA CORRECTION BUFFER

www.ti.com
PACKAGE OPTION ADDENDUM
21-Feb-2005
PACKAGING INFORMATION
Orderable Device
BUF07702PWP
BUF07702PWPR
BUF11702PWP
BUF11702PWPR
BUF11702PWPRG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
HTSSOP
Package
Drawing
PWP
HTSSOP PWP
HTSSOP PWP
HTSSOP PWP
HTSSOP PWP
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20 70
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
20 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
28 50
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
28 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR
28 2000 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1