DAC8501 Datasheet, PDF (2/18 Pages) Burr-Brown (TI) – Low-Power, Rail-to-Rail Output, 16-Bit Serial Input DIGITAL-TO-ANALOG CONVERTER

ABSOLUTE MAXIMUM RATINGS⁽¹⁾
V_DD to GND ........................................................................... –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +V_DD + 0.3V
V_OUT to GND .......................................................... –0.3V to +V_DD + 0.3V
V_REF to GND ........................................................... –0.3V to +V_DD + 0.3V
V_FB to GND ............................................................. –0.3V to +V_DD + 0.3V
Operating Temperature Range ...................................... –40°C to +105°C
Storage Temperature Range ......................................... –65°C to +150°C
Junction Temperature Range (T_J max) ........................................ +150°C
Power Dissipation ........................................................ (T_J max — T_A)/θ_JA
θ_JA Thermal Impedance ......................................................... 206°C/W
θ_JC Thermal Impedance ........................................................... 44°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215°C
Infrared (15s) ........................................................................ +220°C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
PACKAGE
PACKAGE-LEAD DESIGNATOR⁽¹⁾
SPECIFICATION
TEMPERATURE
RANGE
PACKAGE
MARKING
DAC8501E
±64
"
"
±1
MSOP-8
DGK
–40°C to +105°C
D01
"
"
"
"
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
ORDERING
NUMBER
DAC8501E/250
DAC8501E/2K5
TRANSPORT
MEDIA, QUANTITY
Tape and Reel, 250
Tape and Reel, 2500
PIN CONFIGURATIONS
Top View
MSOP
V_DD 1
V_REF 2
V_FB 3
V_OUT 4
DAC8501
8 GND
7 D_IN
6 SCLK
5 SYNC
PIN DESCRIPTION
PIN
NAME
DESCRIPTION
1
V_DD
Power-Supply Input, +2.7V to +5.5V
2
V_REF
Reference Voltage Input
3
V_FB
Feedback connection for the output amplifier.
4
V_OUT
Analog output voltage from DAC. The output ampli-
fier has rail-to-rail operation.
5
SYNC
Level-triggered control input (active LOW). This is
the frame synchronization signal for the input data.
When SYNC goes LOW, it enables the input shift
register and data is transferred in on the falling
edges of the following clocks. The DAC is updated
following the 24th clock cycle unless SYNC is taken
HIGH before this edge, in which case the rising
edge of SYNC acts as an interrupt and the write
sequence is ignored by the DAC8501.
6
SCLK
Serial Clock Input. Data can be transferred at rates
up to 30MHz.
7
D_IN
Serial Data Input. Data is clocked into the 24-bit
input shift register on the falling edge of the serial
clock input.
8
GND
Ground reference point for all circuitry on the part.
2
DAC8501
www.ti.com
SBAS212A