ADS809 Datasheet, PDF (18/20 Pages) Burr-Brown (TI) – 12-Bit, 80MHz Sampling ANALOG-TO-DIGITAL CONVERTER

PACKAGE DRAWING
PHP (S-PQFP-G48)
0,50
36
37
0,27
0,17
25
0,08 M
24
PowerPAD PLASTIC QUAD FLATPACK
Thermal Pad
(see Note D)
48
13
1
1,05
0,95
12
5,50 TYP
7,20
6,80 ^SQ
9,20
8,80 ^SQ
1,20 MAX
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0°– 7°
0,75
0,45
4146927/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
18
ADS809
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SBAS170C