DRV102 Datasheet, PDF (12/19 Pages) Burr-Brown (TI) – PWM SOLENOID/VALVE DRIVER

PACKAGE MOUNTING
Figure 10 provides recommended PCB layouts for both the
TO-220 and DDPAK power packages. The tab of both
packages is electrically connected to ground (pin 4). It may
be desirable to isolate the tab of TO-220 package from its
mounting surface with a mica (or other film) insulator (see
Figure 11). For lowest overall thermal resistance, it is best to
isolate the entire heat sink/DRV102 structure from the
mounting surface rather than to use an insulator between the
semiconductor and heat sink.
For best thermal performance, the tab of the DDPAK sur-
face-mount version should be soldered directly to a circuit
board copper area. Increasing the copper area improves heat
dissipation. Figure 12 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. Power dissipation is equal to the product of
7-Lead TO-220
(Package Drawing #327)
7-Lead DDPAK⁽¹⁾
(Package Drawing #328)
0.51
0.04
0.05
Mean dimensions in inches. Refer to end of data sheet
or Appendix C of Burr-Brown Data Book for tolerances
and detailed package drawings. For further information
on solder pads for surface-mount devices consult
Application Bulletin AB-132.
0.05
0.105
0.035
NOTE: (1) For improved thermal performance increase footprint area.
See Figure 12, “Thermal Resistance versus Circuit Board Copper Area”.
FIGURE 10. TO-220 and DDPAK Solder Footprints.
THERMAL RESISTANCE
vs ALUMINUM PLATE AREA
18
Vertically Mounted
in Free Air
16
Aluminum Plate Area
Flat, Rectangular
Aluminum Plate
14
0.030
12
0.050
10
Aluminum Plate
Thickness (inches)
8
0.062
0
1
2
3
4
5
6
7
8
Aluminum Plate Area (inches²)
Optional mica or film insulator
for electrical isolation. Adds
DRV102
approximately 1°C/W.
TO-220 Package
FIGURE 11. TO-220 Thermal Resistance versus Aluminum Plate Area.
®
DRV102
12