BCP120T_15 Datasheet, PDF (4/5 Pages) BeRex Corporation – HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP

BCP120T
WIRE BONDING INFORMATION
Follow the wire bonding diagrams recommended by BeRex below to achieve optimum device performance. BeRex
recommends thermo-compression wedge bonding. As a general rule, bonding temperature should be kept to a
maximum of 280°C for no longer than 2 minutes for all bonding wires. Ultrasonic bonding is not recommended.
Using 1 mil. diameter, Au bonding wires.
1. Gate to input transmission line
- Length and Height : 600 µm x 250 µm
- Number of wire(s): 2
2. Drain to output transmission line
- Length and Height : 400 µm x 250 µm
- Number of wire(s) : 2
3. Source to ground plate
- Length and Height : 250 µm x 300 µm
- Number of wire(s) : 6
DIE ATTACH RECOMMENDATIONS:
BeRex recommends the “Eutectic” die attach using Au-Sn (80%-20%) pre-forms. The die attach station must have
accurate temperature control, and the operation should be performed with parts no hotter than 300°C for less
than 10 seconds. An inert forming gas (90% N2-10% H2) or clean, dry N2 should be used.
HANDLING PRECAUTIONS:
GaAs FETs are very sensitive to and may be damaged by Electrostatic Discharge (ESD). Therefore, proper ESD
precautions must be taken whenever you are handling these devices. It is critically important that all work
surfaces, and assembly equipment, as well as the operator be properly grounded when handling these devices to
prevent ESD damage.
STORAGE & SHIPPING:
BeRex’s standard chip device shipping package consists of an antistatic “Gel-Pak”, holding the chips, placed inside a
sealed antistatic and moisture barrier bag. This packaging is designed to provide a reasonable measure of
protection from both mechanical and ESD damage.
Chip devices should be stored in a clean, dry Nitrogen gas environment at room temperature until they are
required for assembly. Only open the shipping package or perform die assembly in a work area with a class 10,000
or better clean room environment to prevent contamination of the exposed devices.
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BeRex, Inc. 3350 Scot Blvd. #61-01 Santa Clara, CA 95054 tel. [phone]
Specifications are subject to change without notice. ©BeRex 2015 Rev. 1.7
January 2015