BCL016B Datasheet, PDF (4/5 Pages) BeRex Corporation – SUPER LOW NOISE PHEMT CHIP

P_IN_P_OUT/Gain, PAE (12 GHz)
BCL016B
Frequency = 12GHz
V_DS = 2 V, I_DS = 10 mA (Tuned for Power)
WIRE BONDING INFORMATION
Always follow wire bonding diagrams recommended by BeRex for each device to achieve optimum device
performance and reliability. As a general rule, bonding temperature should be kept to a maximum of 280°C for no
longer than 2 minutes for all bonding wires.
Using 1 mil. Diameter, Au bonding wires.
1. Gate to input transmission line
- Length and Height : 500 µm x 250 µm
- Number of wire(s): 1
2. Drain to output transmission line
- Length and Height : 500 µm x 250 µm
- Number of wire(s) : 1
3. Source to ground plate
- Length and Height : 350 µm x 200 µm
- Number of wire(s) : 4
www.berex.com BeRex, Inc. 1735 North 1^st Street #302 San Jose, CA 95112 T: [phone]; F: [phone] Nov. 2012
Specifications are subject to change without notice. ©BeRex 2012
Rev. 1.7