AA4002 Datasheet, PDF (18/22 Pages) BCD Semiconductor Manufacturing Limited – STEREO 2W AUDIO POWER AMPLIFIER

Data Sheet
STEREO 2W AUDIO POWER AMPLIFIER
AA4002
Application Information (Continued)
will turn off output stage to limit total power
dissipation.
There is an exposed thermal pad on bottom of the chip
to provide the direct thermal path from die to external
heat sink. It is recommended to use copper on the
surface of PC Board as heat sink for AA4002. To dig
some matrix regular holes under chip, set diameter for
each hole at 0.8~1.0mm, keep distance around 1.7mm
between holes, remove copper solder mask of this area,
and make sure to keep them contact well when
soldering to PCB. See Figure 24.
Recommended PCB Layout for AA4002
Using wide traces for power supply, output power to
reduce losses caused by parasitic resistance is
recommended, which can also help to release heat
away from the chip. It is recommended to place bypass
capacitor, power supply bypassing capacitors as close
as possible to the chip. Figure 25, 26 shows the
recommended layout of double layer PCB.
Figure 25. Copper and Holes under the Chip
Sep. 2006 Rev. 1. 1
Figure 26. Top Route, Copper and Silkscreen
BCD Semiconductor Manufacturing Limited
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