AZP51 Datasheet, PDF (8/9 Pages) Arizona Microtek, Inc – Low Phase Noise Sine Wave to LVPECL Buffer/Divider

AZP51
AZP52
AZP53
AZP54
2.90±0.100 ⁵
CL
0.950
0.950
TYP.
TYP.
CL
0.350(MIN)
0.500(MAX)
(6 PLCS)
10° TYP.
(2 plcs)
PACKAGE DIAGRAM
V – SOT-23 6L
NOTE:
1. Dimensions and tolerances are as per ANSI
Y14.5M, 1982.
2. Package surface to be matte finish VDI 11~13.
3. Die is facing up for mold. Die is facing
down for trim/form, ie. reverse trim/form.
4. The footlength measuring is based on the
gauge plane method.
5. Dimension are exclusive of mold flash and gate burr.
6. Dimension are exclusive of solder plating.
10° TYP.
(2 plcs)
SEATING PLANE
0.05(MIN)
0.15(MAX)
10° TYP.
(2 plcs)
10° TYP.
(2 plcs)
0.20 BSC
Gauge Plane
0.127 5
0°~3°
±0.10
0.45
December 2009 * REV - 2
www.azmicrotek.com
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