AZP92 Datasheet, PDF (3/7 Pages) List of Unclassifed Manufacturers – ECL/PECL ÷1, ÷2 Clock Generation Chip with Selectable Enable

AZP92
DIE PAD COORDINATES
AZP92
AM
LK
B _{DIE SIZE: 950u X 940u}
J
I
DIE THICKNESS: 14 MILS
C _{BOND PAD: 85u X 85u}
H
D
G
EF
Notes:
1. Other die thicknesses available. Contact
factory for further information.
2. The die backside may be left open or
connected to V_EE.
NAME
A
B
C
D
E
F
G
H
I
J
K
L
M
SIGNAL
D
D¯
BIAS
V_BB
EN
V_EE
DIV-SEL
Q¯
Q
NC
V_CC
V_CC
EN-SEL
X
(Microns)
-342.5
-342.5
-342.5
-342.5
-33.5
126.5
312.5
312.5
312.5
312.5
302.5
142.5
-140.5
Y
(Microns)
312.5
144.5
-87.0
-255.0
-312.5
-312.5
-248.5
-98.5
51.5
201.5
342.5
342.5
342.5
AZP92NA
MLP 8, 2x2 mm
TOP VIEW
April 2007 REV - 3
www.azmicrotek.com
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