HCPL-5531 Datasheet, PDF (6/13 Pages) AVAGO TECHNOLOGIES LIMITED – Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

Hermetic Optocoupler Options
Option
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This op-
tion is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for
details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
100
2.29 (0.090)
0.51 (0.020)
2.79 (0.110)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and
hi-rel product in 8 and 16 pin DIP. DLA drawing part numbers contain provisions for lead finish.
All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for
details). This option has solder dipped leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
1.40 (0.055)
1.65 (0.065)
2.29 (0.090)
0.51 (0.020)
300
2.79 (0.110)
MAX.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: Solder contains lead.
6
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
1.07 (0.042)
1.32 (0.052)