AMMC-2008 Datasheet, PDF (6/7 Pages) AVAGO TECHNOLOGIES LIMITED – DC–50 GHz SPDT Switch

RF
Output 1
RF
Input
RF
Output 2
Vsel 2
Figure 9. AMMC-2008 Schematic.
Vsel 1
Recommended Operation Conditions
V_sel1
0.6 > 0 > -0.4
V_sel2
-3.5 > -3>-2.5
RF Out1
ON
-3.5>-3>-2.5
0.6>0>-0.4
OFF
0.6>0>-0.4
0.6>0>-0.4
OFF
-3.5>-3>-2.5
-3.5>-3>-2.5
OFF
RF Out2
OFF
ON
OFF
OFF
RF Input
Figure 10. Biasing Diagram.
RF Output 2
Vsel 1
Vsel 2
RF Output 1
Operation
The RF Input and Output ports may be DC or AC-coupled.
If DC‑coupled, the voltages on the Input and Output
ports must be 0 ± 0.25 volts for guaranteed switch per-
formance.
Assembly Techniques
The chip should be attached ­directly to the ground plane
using electrically conductive ­ epoxy^[1,2]. For conductive
epoxy, the amount should be just enough to provide a thin
fillet around the bottom perimeter of the die. The ground
plane should be free of any residue that may jeopardize
electrical or mechanical attachment. Caution should be
taken to not exceed the Absolute Maximum Rating for
assembly temperature and time.
Thermosonic wedge bonding is the preferred method for
wire attachment to the bond pads. The RF ­connections
should be kept as short as possible to minimize induc-
tance. Gold mesh or double-bonding with 0.7 mil gold
wire is recommended.
Mesh can be attached using a 2 mil round tracking tool
and a tool force of approximately 22 grams with an ultra-
sonic power of roughly 55 dB for a duration of 76 ± 8 mS.
A guided wedge at an ultrasonic power level of 64 dB can
be used for the 0.7 mil wire. The recommended wire bond
stage temperature is 150 ± 2°C.
The chip is 100 mm thick and should be handled with
care.
This MMIC has exposed air bridges on the top surface.
Handle at edges or with a custom collet (do not pick up
die with vacuum on die center.)
This MMIC is also static sensitive and ESD handling precau-
tions should be taken.
For more information, see Avago Application Note 5228
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability
of the device.