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| AMMC-2008 Datasheet, PDF (2/7 Pages) AVAGO TECHNOLOGIES LIMITED – DC–50 GHz SPDT Switch | |||
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AMMC-2008 DC Specifications[1]
Symbol Parameters and Test Conditions
Units Min. Typ. Max.
Isel1
Leakage Current at Vsel1 = +0 V, Vsel2 = -3 V µA
20
Isel1
Leakage Current at Vsel1 = -3 V, Vsel2 = +0 V µA
-20
Isel2
Leakage Current at Vsel2 = +0 V, Vsel1 = -3 V µA
20
Isel2
Leakage Current at Vsel2 = -3 V, Vsel1 = +0 V µA
-20
Note:
1. Backside temperature Tb = 25°C unless otherwise noted.
RF Specifications[1,2] (Zin = Zout = 50Ω, Vsel1 = -3V, Vsel2 = 0V)
Symbol Parameters and Test Conditions
Freq.
Units
Min.
Typ.
Max.
IL
Insertion Loss, RFin to RFout (ON throw)
2 GHz
dB
25 GHz
40 GHz
1.6
2
1.6
2
2.0
2.3
ISO
Isolation, RFin to RFout (OFF throw)
2 GHz
dB
25 GHz
40 GHz
46
49
30
35
25
28
RLin
Input Return Loss
2 GHz
dB
40 GHz
15
16.5
15
23
RLout-on
Output Return Loss (ON throw)
2 GHz
dB
40 GHz
15
16.5
15
18
RLout-off
Output Return Loss (OFF throw)
2 GHz
dB
4.5
40 GHz
4.5
P-1dB
Input Power at 1 dB Gain Compression
H2
2nd Harmonic, Pout = +5 dBm
25 GHz
dBm
2 GHz
dBc
12 GHz
+14
-48
-45
-43
-40
H3
3rd Harmonic, Pout = +5 dBm
2 GHz
dBc
12 GHz
-60
-50
-60
-50
IP3
Input 3rd Order Intercept Point,
dBm
RFin1=RFin2 = +5 dBm, âf = 2 MHz
2 GHz
+27
+32
12 GHz +27
+32
Control Switching Speed[3]
10% â 90% rise time
90% â 10% fall time
ps
100
ps
90
Notes:
1. Data measured in wafer form, Tchuck= 25°C.
2. 100% on-wafer RF test is done at frequency = 2, 10, 20, 30 and 40 GHz, except as noted.
3. Typical Vsel switching speed measured using Pulse Generator Model PG5000A. Measurement limited to rise/fall time of Pulse Generator.
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