HCPL-7860-300E Datasheet, PDF (5/18 Pages) AVAGO TECHNOLOGIES LIMITED – Optically Isolated Sigma-Delta (S-D) Modulator

Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
200
160˚C
150˚C
140˚C
100
2.5˚C ± 0.5˚C/SEC.
3˚C + 1˚C/-0.5˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240˚C
SOLDERING
TIME
200˚C
PEAK
TEMP.
230˚C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Use of non-chlorine-activated fluxes is highly recommended.
Recommended Lead Free IR Profile
tp
T_p
T_L
T_smax
T_smin
260 +0/-5˚C
217˚C
RAMP-UP
3˚C/SEC. MAX.
150 - 200˚C
t_s
t_L
PREHEAT
60 to 180 SEC.
TIME WITHIN 5˚C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6˚C/SEC. MAX.
60 to 150 SEC.
25
t 25˚C to PEAK
TIME (SECONDS)
NOTES:
THE TIME FROM 25˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
T_smax = 200˚C, T_smin = 150˚C
Note: Use of non-chlorine-activated fluxes is highly recommended.
Regulatory Information
The HCPL-7860/HCPL-786J has been approved by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2
(VDE 0884 Teil 2):2003-01.
5
UL
Approval under UL 1577, component recognition pro-
gram. File E55361.
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.