HCPL-4562-020 Datasheet, PDF (5/17 Pages) AVAGO TECHNOLOGIES LIMITED – High Bandwidth, Analog/Video Optocouplers

Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t_p
T_p
T_L ^{217 °C}
*_{260 +0/-5 °C}
RAMP-UP
3 °C/SEC. MAX.
T_smax ^{150 - 200 °C}
T_smin
t_s
PREHEAT
t_L
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T_smax = 200 °C, T_smin = 150 °C
Note: Non-halide flux should be used.
* Recommended peak temperature for widebody
400 mils package is 245°C
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW4562 only)