HCPL-M700 Datasheet, PDF (4/9 Pages) Agilent(Hewlett-Packard) – Small Outline, 5 Lead, Low Input Current, High Gain Optocouplers

Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t_p
T_p
260 +0/-5 °C
T_L ^{217 °C}
RAMP-UP
3 °C/SEC. MAX.
T_smax ^{150 - 200 °C}
T_smin
t_s
PREHEAT
t_L
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T_smax = 200 °C, T_smin = 150 °C
Note: Non-halide flux should be used.
Insulation Related Specifications
Parameter
Min. External Air Gap
(Clearance)
Min. External Tracking Path
(Creepage)
Min. Internal Plastic Gap
(Clearance)
Tracking Resistance
Isolation Group (per DIN VDE 0109)
Symbol
L(IO1)
L(IO2)
CTI
Value
≥5
≥5
0.08
175
IIIa
Units
mm
mm
mm
V
Conditions
Measured from input terminals
to output terminals
Measured from input terminals
to output terminals
Through insulation distance
conductor to conductor
DIN IEC 112/VDE 0303 Part 1
Material Group DIN VDE 0109
4