HCPL-814 Datasheet, PDF (4/7 Pages) Agilent(Hewlett-Packard) – AC Input Phototransistor Optocoupler High Density Mounting Type

HCPL-814-300E
4.6 ± 0.5
(0.181)
LEAD FREE
ANODE
A 814
Y WW
DATE CODE
6.5 ± 0.5
(0.256)
1.2 ± 0.1
(0.047)
RANK
3.5 ± 0.5
(0.138)
2.54 ± 0.25
(0.1)
0.35 ± 0.25
(0.014)
DIMENSIONS IN MILLIMETERS AND (INCHES)
7.62 ± 0.3
(0.3)
1.0 ± 0.25
(0.039)
10.16 ± 0.3
(0.4)
0.26
(0.010)
Solder Reflow Temperature Profile
1) One-time soldering reflow is recommended within
the condition of temperature and time profile shown
at right.
2) When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package of
the device within the condition of (1) above.
150°C
25°C
250°C
217°C
200°C
30 seconds
260°C (Peak Temperature)
60 sec
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Note: Non-halide flux should be used.
Absolute Maximum Ratings
Parameters
Symbol
Min.
Max.
Units
Storage Temperature
Ambient Operating Temperature
Lead Solder Temperature for 10s
(1.6 mm below seating plane)
T_S
–55
125
˚C
T_A
–30
100
˚C
T_sol
260
˚C
Average Forward Current
Input Power Dissipation
Collector Current
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage
(AC for 1 minute, R.H. = 40 ~ 60%)^[1]
I_F
P_I
I_C
V_CEO
V_ECO
P_C
P_tot
V_iso
±50
mA
70
mW
50
mA
35
V
6
V
150
mW
200
mW
5000
V_rms