HMPS-2820 Datasheet, PDF (3/8 Pages) AVAGO TECHNOLOGIES LIMITED – MiniPak Surface Mount RF Schottky Barrier Diodes Single and dual versions

Linear Equivalent Circuit Model Diode Chip
R_j
R_S
C_j
R_S = series resistance (see Table of SPICE parameters)
C_j = junction capacitance (see Table of SPICE parameters)
R_j =
8.33 X 10^-5 nT
I_b + I_s
where
I_b = externally applied bias current in amps
I_s = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-282x product, please refer
to Application Note AN1124.
MiniPak 1412 Linear Circuit Model of the Diode’s Package
20 fF
3
4
30 fF
30 fF
1.1 nH
2
1
20 fF
Single diode package (HMPx-x8x0)
SPICE Parameters
Parameter
B_V
C_J0
E_G
I_BV
I_S
N
R_S
P_B
P_T
M
Units
V
pF
eV
A
A
Ω
V
HMPS-282x
15
0.7
0.60
1E-4
2.2E-8
1.08
8.0
0.65
2
0.5
Minipak QFN Linear Circuit Model of the Diode’s Package
19 fF
0.043 nH
3
0.328 nH 0.328 nH
0.053 nH
4
20 fF
0.045 nH
2
2 fF
0.329 nH 0.329 nH
16 fF
0.053 nH
1
18 fF
Parallel diode package (HMPx-x8x5)
0.043 nH
3
20 fF
0.045 nH
2
19 fF
0.328 nH 0.328 nH
2 fF
0.329 nH 0.329 nH
0.053 nH
4
16 fF
0.053 nH
1
18 fF
Anti-Parallel diode package (HMPx-x8x2)