HMPS-2820 Datasheet, PDF (1/8 Pages) AVAGO TECHNOLOGIES LIMITED – MiniPak Surface Mount RF Schottky Barrier Diodes Single and dual versions

HMPS-282x Series
MiniPak Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
Features
These ultra-miniature products represent the blending of
Avago Technologies’ proven semiconductor and the latest
in leadless packaging. This series of Schottky diodes is
the most consistent and best all-round ­ device available,
and finds applications in mixing, detecting, switching,
sampling, clamping and wave shaping at frequencies up
to 6 GHz. The MiniPak package offers ­ reduced parasit-
ics when compared to conventional leaded diodes, and
lower thermal resistance.
The HMPS-282x family of diodes offers the best all-around
choice for most applications, featuring low series resis-
tance, low forward voltage at all current levels and good
RF characteristics.
• Surface mount MiniPak package
• Better thermal conductivity for higher power
dissipation
• Single and dual versions
• Matched diodes for consistent performance
• Low turn-on voltage (as low as 0.34 V at 1 mA)
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
• For more information, see the Surface Mount
Schottky Reliability Data Sheet.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest ­degree of match.
Minipak 1412 is a ceramic based package, while Minipak
QFN is a leadframe based package.
Package Lead Code Identification (Top View)
Pin Connections and Package Marking
Single
3
4
2
1
#0
(MiniPak 1412)
Anti-parallel
3
4
2
1
#2
(MiniPak 1412)
Anti-parallel
3
4
Parallel
3
4
2
1
#5
(MiniPak 1412)
Parallel
3
4
3
4
AA
2
1
Product code Date code
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
2
1
#2
(MiniPak QFN)
2
1
#5
(MiniPak QFN)