HCPL-M453-000E Datasheet, PDF (3/9 Pages) AVAGO TECHNOLOGIES LIMITED – Small Outline, 5 Lead, High Speed Optocouplers

Schematic
+ ^IF
ANODE
1
V_F
–
CATHODE
3
SHIELD
I_{CC 6}
V_CC
I_{O 5}
V_O
4
GND
Land Pattern Recommendation
4.4
(0.17)
2.5
(0.10)
2.0
(0.080)
8.27
(0.325)
Dimensions in millimeters and (inches)
1.3
(0.05)
0.64
(0.025)
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
30
TIME
SEC.
200°C
30
SEC.
50 SEC.
ROOM
TEMPERATURE
00
50
100
150
TIGHT
TYPICAL
LOOSE
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision).
Non-Halide Flux should be used.
3