HCPL-5731 Datasheet, PDF (3/12 Pages) AVAGO TECHNOLOGIES LIMITED – Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers

Functional Diagrams
16 pin DIP
Through Hole
4 Channels
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
8 pin DIP
Through Hole
1 Channel
1
8
2
7
3
6
4
5
8 pin DIP
Through Hole
2 Channels
1
8
2
7
3
6
4
5
16 pin Flat Pack
Unformed Leads
4 Channels
1
16
2
1155
3
1144
4
13
5
12
6
11
7
10
8
9
20 Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
VO2 ₁₃
GND2
20
12
2
VCC1 10
3
GND1
VO1
78
Note: All DIP and flat pack devices have common V_CC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate
V_CC and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 4 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
0.51 (0.020)
MIN.
4.45 (0.175)
MAX.
3.81 (0.150)
MIN.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
Note: Dimensions in Millimeters (Inches)
8.13 (0.320)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
Leaded Device Marking
Avago LOGO
Avago P/N
DLA SMD*
DLA SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
t 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE*
*QUALIFIED PARTS ONLY
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
t XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD*
DLA SMD*
Avago CAGE CODE*
3