AFBR-79EQDZ_15 Datasheet, PDF (14/19 Pages) AVAGO TECHNOLOGIES LIMITED – Parallel Fiber-Optics Module

Package Outline, Host PCB Footprint and Bezel Design
71
18.5
18.35
3
1
53
12.9
8.20
All dimensions in mm
Figure 13. Mechanical Package Outline
X
Y
BASIC
BASIC
37.00 MAX.
11.30 MIN.
Ø1.05 ±0.05
12 PLC
7.60
10.60
Ø0.10 M A K S L S
3.10
9.00
6 PLC
L
8.50
3.40
17.90 REF.
22.15
19.00
K
Cross-hatched area denotes
component and trace keep-out
(except chassis ground)
7.60
3.10
This area denotes
component keep-out
(traces allowed)
Notes:
1. Datum X & Y are established by the customer’s fiducial
2. Datum A is the top surface of the host board
3. Location of the edge of PCB is application specific
4. Finished hole size
All dimensions in mm
Figure 14. QSFP+ Host Board Mechanical Footprint
14
7.20
16.80
1.10
C