AMMC-5620 Datasheet, PDF (1/8 Pages) AVAGO TECHNOLOGIES LIMITED – 6 - 20 GHz High Gain Amplifier

AMMC-5620
6 - 20 GHz High Gain Amplifier
Data Sheet
Chip Size: 1410 x 1010 µm (55.5 x 39.7 mils)
Chip Size Tolerance: ± 10 µm (± 0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Description
Avago Technologies’ AMMC-5620 MMIC is a GaAs wide-
band amplifier designed for medium output power and
high gain over the 6 - 20 GHz frequency range. The 3
cascaded stages provide high gain while the single bias
supply offers ease of use. It is fabricated using a PHEMT
integrated circuit process. The RF input and output ports
have matching circuitry for use in 50-Ω environments.
The backside of the chip is both RF and DC ground. This
helps simplify the assembly process and reduces assembly
related performance variations and costs. For improved
reliability and moisture protection, the die is passivated
at the active areas. The MMIC is a cost effective alternative
to hybrid (discrete FET) amplifiers that require complex
tuning and assembly processes.
Features
• Frequency Range: 6 - 20 GHz
• High Gain: 19 dB Typical
• Output Power: 15dBm Typical
• Input and Output Return Loss: < -10 dB
• Positive Gain Slope: + 0.21dB/GHz Typical
• Single Supply Bias: 5 V @ 95 mA Typical
Applications
• General purpose, wide-band amplifier in communica-
tion systems or microwave instrumentation
• High gain amplifier
AMMC-5620 Absolute Maximum Ratings^[1]
Symbol
V_DD
I_DD
P_DC
P_in
T_ch
T_b
T_stg
T_max
Parameters/Conditions Units
Drain Supply Voltage
V
Total Drain Current
mA
DC Power Dissipation
W
RF CW Input Power
dBm
Channel Temp.
°C
Operating Backside Temp. ° C
Storage Temp.
°C
Maximum Assembly Temp. ° C
(60 sec max)
Min.
- 55
- 65
Max.
7.5
135
1.0
20
+150
+165
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended.
Ensure that an ESD approved carrier is used when dice are transported from one destination to
another. Personal grounding is to be worn at all times when handling these devices