AT24C08C-STUM-T Datasheet, PDF (21/24 Pages) ATMEL Corporation – I2C-Compatible, (2-wire) Serial EEPROM 4-Kbit (512 x 8), 8-Kbit (1024 x 8)

12.4 5TS1 – SOT23
e1
5
4
C
E1
E
CL
1
2
3
Top View
b
L1
End View
A2 _A
SEATING
PLANE
e
A1
D
Side View
Notes:
1. Dimensions D does not include mold flash, protrusions or gate
burrs. Mold flash protrusions or gate burrs shall not exceed
0.15mm per end. Dimensions E1 does not include interlead flash or
protrusion. Interlead flasg or protrusion shall not exceed 0.15mm
per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are deteremined at the outermost extremes
of the plastic body exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
4. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.80mm total in excess of the “b”
dimension at maximum material condition. The dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and an adjacent lead shall not be less than 0.07mm.
5. This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
c
D
E
E1
L1
e
e1
b
MIN NOM MAX
–
–
1.10
0.00
–
0.10
0.70 0.90 1.00
0.08
–
0.20
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
0.30
–
0.50
NOTE
3
1, 2
1, 2
1, 2
3, 4
TITLE
Package Drawing Contact: 5TS1, 5-lead, 1.60mm Body, Plastic Thin
[e-mail] Shrink Small Outline Package (Shrink SOT)
GPC
11/05/08
DRAWING NO. REV.
TSZ
5TS1
B
Atmel AT24C04C/08C [DATASHEET] 21
8787B–SEEPR–5/12