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AT24C08C-STUM-T Datasheet, PDF (19/24 Pages) ATMEL Corporation – I2C-Compatible, (2-wire) Serial EEPROM 4-Kbit (512 x 8), 8-Kbit (1024 x 8)
12.2 8X – TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
Top View
A
b
A1
e
A2
D
Notes:
Side View
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
H
L
End View
SYMBOL
A
A1
A2
D
E
E1
b
e
L
L1
C
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
-
0.05
0.80
2.90
4.30
0.19
0.45
0.09
NOM
-
-
1.00
3.00
6.40 BSC
4.40
–
0.65 BSC
0.60
1.00 REF
-
MAX
1.20
0.15
1.05
3.10
4.50
0.30
0.75
0.20
NOTE
2, 5
3, 5
4
TITLE
Package Drawing Contact: 8X, 8-lead 4.4mm Body, Plastic Thin
packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
GPC
12/8/11
DRAWING NO. REV.
TNR
8X
E
Atmel AT24C04C/08C [DATASHEET] 19
8787B–SEEPR–5/12