PC7447A Datasheet, PDF (20/44 Pages) ATMEL Corporation – PowerPC RISC microprocessor

7. Pin Assignment
Figure 7-1 shows the pinout of the PC7447A, 360 high coefficient of the thermal expansion
ceramic ball grid array (HITCE) package as viewed from the top surface. Figure 7-2 shows the
side profile of the HITCE package to indicate the direction of the top surface view.
Figure 7-1.
Pinout of the PC7447A, 360 HITCE Package as Viewed from the Top Surface
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Figure 7-2. Side View of the CBGA Package
Substrate Assembly
View
Die
Encapsulant
20 PC7447A [Preliminary]
5387B–HIREL–07/05