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AT24C16C_14 Datasheet, PDF (17/23 Pages) ATMEL Corporation – IC-Compatible, (2-Wire) Serial EEPROM
13.2 8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
Top View
A
b
A1
e
A2
D
Notes:
Side View
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
L
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
D
E
E1
b
e
L
L1
C
MIN
-
0.05
0.80
2.90
4.30
0.19
0.45
NOM MAX NOTE
-
1.20
-
0.15
1.00 1.05
3.00 3.10 2, 5
6.40 BSC
4.40 4.50 3, 5
–
0.30
4
0.65 BSC
0.60 0.75
1.00 REF
0.09
-
0.20
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
6/22/11
DRAWING NO. REV.
TNR
8X
D
Atmel AT24C16C [DATASHEET] 17
Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013