ATZB-X0-256-3-0-C_14 Datasheet, PDF (15/28 Pages) ATMEL Corporation – ZIGBIT 2.4GHZ WIRELESS MODULES

Figure 3-5. Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Alternative Placement)
The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The
Recommended placement of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the end
application
Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior
performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers
of the carrier board
The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be
equal to or greater than 33mm
3.6 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9. Soldering profile⁽¹⁾
Profile feature
Average ramp-up rate (217°C to peak)
Preheat temperature 175°C ±25°C
Temperature maintained above 217°C
Time within 5°C of actual peak temperature
Peak temperature range
Ramp-down rate
Green package
3°C/s max
180s max
60s to 150s
20s to 40s
260°C
6°C/s max
ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] ¹⁵
42172B−WIRELESS−03/2014