ATZB-X0-256-4-0-CN_14 Datasheet, PDF (14/26 Pages) ATMEL Corporation – ZIGBIT 900MHZ WIRELESS MODULES

3.6 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9. Soldering profile ⁽¹⁾
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max.
Preheat temperature 175°C ±25°C
180s max.
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max.
Time within 25°C to peak temperature
8 minutes
Note: 1. The package is backward compatible with PB/Sn soldering profile.
3.7 Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
• Placing high profile components next to antenna should be avoided
• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern
• ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268B−WIRELESS−07/2014
14