AT24C16B_08 Datasheet, PDF (13/27 Pages) ATMEL Corporation – Two-wire Serial EEPROM

AT24C16B
AT24C16B Ordering Information
Ordering Codes
Voltage
Package
Operating Range
AT24C16B-PU (Bulk Form Only)
1.8
8P3
AT24C16BN-SH-B⁽¹⁾ (NiPdAu Lead Finish)
1.8
8S1
AT24C16BN-SH-T⁽²⁾ (NiPdAu Lead Finish)
1.8
8S1
AT24C16B-TH-B⁽¹⁾ (NiPdAu Lead Finish)
1.8
8A2
AT24C16B-TH-T⁽²⁾ (NiPdAu Lead Finish)
1.8
8A2
AT24C16BY6-YH-T⁽²⁾ (NiPdAu Lead Finish)
1.8
8Y6
Lead-Free/Halogen-Free
Industrial Temperature
(-40°C to 85°C)
AT24C16BD3-DH-T⁽²⁾ (NiPdAu Lead Finish)
1.8
8D3
AT24C16BTSU-T⁽²⁾
1.8
5TS1
AT24C16BU3-UU-T⁽²⁾
1.8
8U3-1
AT24C16B-W-11⁽³⁾
1.8
Die Sales
Industrial Temperature
(-40°C to 85°C)
Notes: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT23, dBGA2 = 5K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
8P3
8S1
8A2
8Y6
5TS1
8U3-1
8D3
–1.8
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Options
Low-voltage (1.8V to 5.5V)
13
5175D–SEEPR–6/08