AT24C02B Datasheet, PDF (13/26 Pages) ATMEL Corporation – Two-wire Serial EEPROM

AT24C02B
AT24C02B Ordering Information
Ordering Code
Voltage
Package
Operation Range
AT24C02B-PU (Bulk form only)
AT24C02BN-SH-B⁽¹⁾ (NiPdAu Lead Finish)
AT24C02BN-SH-T⁽²⁾ (NiPdAu Lead Finish)
AT24C02B-TH-B⁽¹⁾ (NiPdAu Lead Finish)
AT24C02B-TH-T⁽²⁾ (NiPdAu Lead Finish)
AT24C02BY6-YH-T⁽²⁾ (NiPdAu Lead Finish)
AT24C02B-TSU-T⁽²⁾
AT24C02BU3-UU-T⁽²⁾
1.8
8P3
1.8
8S1
1.8
8S1
1.8
8A2
1.8
8A2
1.8
8Y6
1.8
5TS1
1.8
8U3-1
Lead-free/Halogen-free/
Industrial Temperature
(–40C to 85C)
AT24C02B-W-11⁽³⁾
1.8
Die Sale
Industrial Temperature
(–40C to 85C)
Notes: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial Interface Marketing.
8P3
8S1
8A2
8Y6
5TS1
8U3-1
–1.8
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
Options
Low-voltage (1.8V to 5.5V)
13
5126H–SEEPR–8/07