ALUC2380B1 Datasheet, PDF (1/3 Pages) Advanced Semiconductor Business Inc. – Internally Matched Balanced LNA Module Including Coupler

Features
· S21 = 2173.25 dB@187860 MHz
= 2162.85 dB@1390200 MHz
· NF of 01.65ddBBovoever rFFrereqqueunecnycy
· Unconditionally Stable
· Single 5 V Supply
· High OIP3@Low Current
· 21-stage Balanced Type
plerow^TM ALUC2380B1
Internally Matched Balanced LNA Module
Including Coupler
Specifications (in Production)
Typ.@T = 25 C, Vs = 5 V, Freq. = 2380 MHz, Zo.sys = 50 ohms
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3 ⁽¹⁾
S11/S22 ⁽²⁾
Output P1dB
Switching Time ⁽³⁾
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
Unit
MHz
dB
dB
dB
dBm
dB
dBm
sec
mA
V

dBm
mm
Specifications
Min
Typ
Max
1760
3000
12.0
13.0
0.5
0.6
1.6
1.7
30
31
-11/-9
18
19
-
180
200
5
50
C.W 29~31(before fail)
Surface Mount Type, 16Wx13Lx5H
Operating temperature is –40 C to +85 C.
1) OIP3 is measured with two tones at an output power of +4 dBm/tone separated by 1 MHz.
2) S11, S22(max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
1-stage Balanced Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
1
10
2
9
3 ^ALUC2380B1 8
4
7
5
6
(Top View)
Solder Stencil Area
(Right side View)
Port Number
2
7
6, 10
Others, Bottom
Function
RF In
RF Out
Vs
GND
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Bottom side View)
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
January 2010