24005 Datasheet, PDF (2/2 Pages) Aries Electronics, Inc. – Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, μBGA and Bumped Die Devices

Long-Life Hi-Frequency Sockets for BGA, LGA,
QFN, MLCC, µBGA and Bumped Die Devices
High-Performance Interposer Contact Technology
Suitable for Manual & Automated High-Volume Production Test
Interposer Contact System Life: QFN 0.5mm Pitch, 1.0mm Full Height
AR200 Series: 1.0mm Full Height
Specifications
(measured in a 0.5mm pitch environment, GSG)
Insertion Loss S21: -1dB @ 40GHz
Return Loss S11 thru: -15dB @ 22GHz
Self Inductance: 0.33nH
Mutual Capacitance: <0.05pF
Operating Temperature: -55°C to 155°C
Contact Resistance: <25mΩ
Current Rating: 4A per lead with a 14°C rise
Contact Length (compressed): 1.04mm
Contact Force/Travel: 25-45 gf/0.4mm travel
Contact Set Life: >2,000,000 insertions
Interposer Elastomer Life: >500,000 insertions
AR300 Series: 0.6mm Half Height
Specifications
(estimated 0.5mm pitch environment, GSG)
Insertion Loss S21: -1dB @ >40GHz
Return Loss S11 thru: -15dB @ >22GHz
Self Inductance: <0.15nH
Mutual Capacitance: <0.02pF
Operating Temperature: -55°C to 155°C
Contact Resistance: <25mΩ
Current Rating: 4A per lead with a 14°C rise
Contact Length (compressed): 0.63mm
Contact Force/Travel: 25-45 gf/0.28mm travel
Contact Set Life: >2,000,000 insertions
Interposer Elastomer Life: >500,000 insertions
Interposer Elastomer Conductive Columns, available in 2 Standard Heights with
Standard & Custom Pitches from 1.27mm to 0.4mm
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24005
Rev. 1.2
2 of 2