24005 Datasheet, PDF (1/2 Pages) Aries Electronics, Inc. – Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, μBGA and Bumped Die Devices

Long-Life Hi-Frequency Sockets for BGA, LGA,
QFN, MLCC, µBGA and Bumped Die Devices
Ideally Suited for RFIC and Microwave IC Development & Test
Interposer Contact System – AR200 and AR300 Series Test Sockets
Announcing significant improvements to our high-performance contact system. Using our proven Interposer Elastomer Technology,
the new CORE feature internally controls compression to ensure stability with extremely low resistance values and much longer
contact element life. (See Interposer Contact System Life on following page).
Low interconnect parasitics make these sockets an ideal choice for device characterization or high-volume production testing of
devices, such as power amplifiers, mixers, highly integrated RF ICs, and microwave devices.
ORDERING INFORMATION
This material can be ordered with
ANY Aries RF/CSP Sockets
Insertion Loss of -1dB @ 40GHz
Return Loss of -15dB @ 22GHz
Interposer contact system with very short interconnects (available in 1.0mm or
0.6mm thickness) enhance adjacent channel power and noise sensitivity
measurements.
FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE
PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.
Hand Test
Automation
QFN Footprint
CONTACT SET
Interposer footprint lets the PCB
designer locate impedance matching
network components within 1mm of
device pads.
INTERPOSER
Top Side
Tips Pierce DUT
Bottom Side
Column Array
Tails Compress Columns Elastomer Matrix Compliant Buttons
Cross Section
Ag Particles
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24005
Rev. 1.2
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