24008 Datasheet, PDF (1/2 Pages) Aries Electronics, Inc. – High-Frequency Center Probe Test Socket for Devices up to 13mm Square

High-Frequency Center Probe Test Socket
for Devices up to 13mm Square
FEATURES
• Aries unique universal socketing system allows the socket to be easily configured for any package, on
any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge
or extra lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC,
LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged
devices.
• Quick and easy Probe Replacement System: the complete set of probes can be removed and a new
set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair
and sent back within one day.
• Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression
Spring-Probes which are accurately located by two molded plastic alignment pins and mounted with four
stainless steel screws.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls.
• Standard molded socket format can accommodate any device package of 13mm or smaller, by
using machined (for small quantities) or custom molded (for large quantities) pressure pads and
ORDERING INFORMATION
interposers.
Consult Factory
• Pressure pad compression spring provides proper force against device and allows for height
variations in device thickness.
CLEANING, HANDLING, MOUNTING
• 4-point crown insures scrub on solder balls, and raised tip probe provides scrub on pads.
& PROBE REPLACEMENT INFO
• Signal path during test only 0.077 [1.96].
GENERAL SPECIFICATIONS
• 1dB BANDWIDTH: 18.5 GHz, <3dB to 39.7 GHz (0.50mm pitch)
• PIN INDUCTANCE: 0.59nH (0.50mm pitch)
• MUTUAL CAPACITANCE: 0.12pF
• VSWR: <2:1 to 38Ghz
• CONTACT RESISTANCE: <40 mΩ
• COMPRESSION SPRING PROBES: heat-treated BeCu
• COMPRESSION SPRING PROBE PLATING: 30µ [0.75µ] min. Au per MIL-G-45204 over 30µ
[0.75µ] min. Ni per SAE AMS-QQ-N-290
• ESTIMATED CONTACT LIFE: 500,000 cycles minimum
• CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch

: 15g per contact on 0.30-0.35mm pitch

: 16g per contact on 0.40-0.45mm pitch

: 25g per contact on 0.50-0.75mm pitch

: 25g per contact on 0.80mm pitch or larger
• OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°C] max.
• MOLDED SOCKET COMPONENTS: UL 94V-0 Ultem
MOUNTING CONSIDERATIONS
• See “PCB FOOTPRINT TOP VIEW” for requirements
• REQUIRES: four #2-56 Screws and PEM nuts for mounting (not supplied) Mounting holes
size shown may differ depending on PEM nut selected
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
to avoid damaging spring contacts
• TEST PCB MINIMUM DIAMETER “G”: 0.025 [0.64] (large probe 0.80mm pitch and larger)

: 0.015 [0.38] (small probe 0.50-0.75mm pitch)

: 0.012 [0.31] (small probe 0.40-0.45mm pitch)

: 0.009 [0.23] (small probe 0.30-0.35mm pitch)

: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
A detailed device drawing must be
sent to Aries to quote and design
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See Data Sheet for...
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
23020 µBGA up to 55mm
23023 Optical Failure Analysis
RF Sockets
24013 RF up to 6.5mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
24012 RF up to 55mm
24010 RF Machined Socket
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL [phone] • FAX [phone]
WWW.ARIESELEC.COM • [e-mail]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24008
1 of 2
Rev. 1.5