AP89042_15 Datasheet, PDF (19/19 Pages) Aplus Intergrated Circuits – APLUS INTEGRATED CIRCUITS INC

Integrated Circuits Inc.
Bonding Diagram
aP89042
Bonding pad size: 80um x 90um
MODE pad MUST be not connected.
Pad Name
VDD
MODE
S3
S4
SBT
RST
S7
S8
OUT1
VOUT1
VOUT2
Location (X,Y)
2199.83, 1276.99
1918.34, 1281.99
1652.19, 1281.99
1448.56, 1281.99
1182.62, 1281.99
978.99, 1281.99
713.23, 1281.99
509.60, 1281.99
243.99, 1281.99
173.70, 1014.23
713.70, 614.27
Pad Name
VSS
OUT2
OUT3
COUT
OSC
S5
S6
VPP
S1
S2
Location (X,Y)
173.70, 358.65
173.70, 138.00
439.31, 138.00
642.94, 138.00
1276.09, 138.00
1745.66, 138.00
1949.29, 138.00
2200.12, 299.45
2200.09, 834.58
2200.09, 1038.21
Ver5.0
19
Aug 23, 2010