AO4606_12 Datasheet, PDF (2/9 Pages) Alpha & Omega Semiconductors – 30V Complementary MOSFET

AO4606
N-Channel Electrical Characteristics (T_J=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BV_DSS Drain-Source Breakdown Voltage
I_D=250µA, V_GS=0V
30
V
I_DSS
Zero Gate Voltage Drain Current
V_DS=30V, V_GS=0V
T_J=55°C
1
µA
5
I_GSS
Gate-Body leakage current
V_DS=0V, V_GS=±20V
±100
nA
V_GS(th) Gate Threshold Voltage
V_DS=V_GS I_D=250µA
1.2 1.8 2.4
V
I_D(ON)
On state drain current
V_GS=10V, V_DS=5V
30
A
R_DS(ON) Static Drain-Source On-Resistance
V_GS=10V, I_D=6A
T_J=125°C
25
30
mΩ
40
48
V_GS=4.5V, I_D=5A
33.5 42
mΩ
g_FS
Forward Transconductance
V_DS=5V, I_D=6A
15
S
V_SD
Diode Forward Voltage
I_S=1A,V_GS=0V
0.76 1
V
I_S
Maximum Body-Diode Continuous Current
2.5
A
DYNAMIC PARAMETERS
C_iss
Input Capacitance
C_oss
Output Capacitance
C_rss
Reverse Transfer Capacitance
R_g
Gate resistance
V_GS=0V, V_DS=15V, f=1MHz
V_GS=0V, V_DS=0V, f=1MHz
200 255 310
pF
30
45
60
pF
20
35
50
pF
1.6 3.25 4.9
Ω
SWITCHING PARAMETERS
Q_g(10V) Total Gate Charge
4
5.2
6
nC
Q_g(4.5V) Total Gate Charge
Q_gs
Gate Source Charge
V_GS=10V, V_DS=15V, I_D=6A
2 2.55 3
nC
0.85
nC
Q_gd
Gate Drain Charge
1.3
nC
t_D(on)
Turn-On DelayTime
4.5
ns
t_r
Turn-On Rise Time
V_GS=10V, V_DS=15V, R_L=2.5Ω,
2.5
ns
t_D(off)
Turn-Off DelayTime
R_GEN=3Ω
14.5
ns
t_f
Turn-Off Fall Time
3.5
ns
t_rr
Body Diode Reverse Recovery Time ^IF^{=6A, dI/dt=100A/µs}
8.5 12
ns
Q_rr
Body Diode Reverse Recovery Charge ^IF^{=6A, dI/dt=100A/µs}
2.2
3
nC
A. The value of R_θJA is measured with the device mounted on 1in² FR-4 board with 2oz. Copper, in a still air environment with T_A =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P_D is based on T_J(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T_J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialT_J=25°C.
D. The R_θJA is the sum of the thermal impedence from junction to lead R_θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in² FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T_J(MAX)=150°C. The SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 10: April 2012
www.aosmd.com
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