APX9132 Datasheet, PDF (9/11 Pages) Anpec Electronics Coropration – Hall Effect Micro Switch IC

APX9132
Physical Specifications
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
3000 devices per reel
Reflow Condition (IR/Convection or VPR Reflow)
T_P
tp
Critical Zone
Ramp-up
T_L to T _P
T_L
t_L
Tsmax
Tsmin
ts
Preheat
Ramp-down
25
t 25^°C to Peak
Classificatin Reflow Profiles
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate
(T_L to T _P)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
3°C/second max.
100°C
150°C
60-120 seconds
3°C/second max.
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (T_L)
- Time (t_L)
183^°C
60-150 seconds
217^°C
60-150 seconds
Peak/Classificatioon Temperature (Tp)
See table 1
See table 2
Time within 5^°C of actual
Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-down Rate
6^°C/second max.
6^°C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Notes: All temperatures refer to topside of the package .Measured on the body surface.
C opyright © ANPEC Electronics C orp.
9
Rev. A.1 - Nov., 2005
www.anpec.com.tw