APX9132 Datasheet, PDF (10/11 Pages) Anpec Electronics Coropration – Hall Effect Micro Switch IC

APX9132
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm³
Volume mm³
<350
≥350
<2.5 mm
240 +0/-5 ^°C
225 +0/-5^°C
≥_{2.5 mm}
225 +0/-5 ^°C
225 +0/-5^°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm³
Volume mm³
Volume mm³
<350
350 -2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥_{2.5 mm}
250 +0^°C*
245 +0^°C*
245 +0^°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0 °C.
For example 260^°C+0 ^°C) at the rated MSL level.
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C , 5 SEC
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121°C
-65°C ~ 150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , I_tr > 100mA
Carrier Tape & Reel Dimensions
t
Po
P
D
E
P1
F
Bo
W
Ko
Ao
D1
C opyright © ANPEC Electronics C orp.
10
Rev. A.1 - Nov., 2005
www.anpec.com.tw