B0110E50200AHF Datasheet, PDF (5/6 Pages) Anaren Microwave – Ultra Low Profile 1008 Balun

Model B0110E50200AHF
RevA
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
To supply common mode voltage offset to the analog-to-digital converter, DC blocking capacitors are
needed at the balanced port (pins 6 & 8).
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances. In addition, two external 0402 capacitors must be mounted in locations C1 and
C2 as shown in the figure below to get the performance specified in the datasheet.
.06
Plated thru
hole(s) to
Ground
0402 Capacitor
.06
0402 Capacitor
4x .22
10x .28
3x Transmission Line
6x .29
10x .36
4x .15
Circuit Pattern
Footprint Pad(s)
Solder Resist
External Component Footprint
Dimensions are in millimeters
Part Orientation
(Top View)
Available on Tape
and Reel for Pick and
Place Manufacturing.
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