B0922J7575A00 Datasheet, PDF (3/5 Pages) Anaren Microwave – Ultra Low Profile 0805 Balun 75Ω to 75Ω Balanced

Model B0922J7575A00
Rev C
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/^oC.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
Mounting Footprint
6X .016
[0.35]
4X .012
[0.30]
Part Orientation (Top View)
6X .013
[0.33]
6X .002
[0.05]
.026
[0.66]
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Inches [Millimeters]
Mounting Footprint
Plated thru
holes to
ground
Available on Tape
and Reel for Pick and
Place Manufacturing.
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