XC2500E-10 Datasheet, PDF (14/22 Pages) Anaren Microwave – 10 dB Directional Coupler

Model XC2500E-10
Rev B
Mounting
In order for Xinger surface mount couplers to work optimally,
there must be 50Ω transmission lines leading to and from all of
the RF ports. Also, there must be a very good ground plane
underneath the part to ensure proper electrical performance. If
either of these two conditions is not satisfied, insertion loss,
coupling, VSWR and isolation may not meet published
specifications.
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high
volume usage.
Overall ground is improved if a dense population of plated
through holes connect the top and bottom ground layers of the
PCB. This minimizes ground inductance and improves ground
continuity. All of the Xinger hybrid and directional couplers are
constructed from ceramic filled PTFE composites which
possess excellent electrical and mechanical stability having X
and Y thermal coefficient of expansion (CTE) of 17-25 ppm/^oC.
When a surface mount hybrid coupler is mounted to a printed
circuit board, the primary concerns are; ensuring the RF pads
of the device are in contact with the circuit trace of the PCB
and insuring the ground plane of neither the component nor
the PCB is in contact with the RF signal.
Mounting Footprint
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder connection underneath the part
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger II products are
available in either an immersion tin or tin-lead finish.
Commonly used storage procedures used to control
oxidation should be followed for these surface mount
components. The storage temperatures should be held
between 15^OC and 60^OC.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This
coefficient minimizes solder joint stresses due to similar
expansion rates of most commonly used board
substrates such as RF35, RO4350, FR4, polyimide and
G-10 materials. Mounting to “hard” substrates (alumina
etc.) is possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with either an immersion tin or tin-lead
exterior finish.
.090
[2.29]
.450
[11.43]
Multiple
plated thru holes
to ground
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger II surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
.025
[0.63]
4X .066 SQ
[1.68]
Dimensions are in Inches [Millimeters]
XC2500E-10* Mounting Footprint
4X 50 Ω
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